khaskhabar.com : Monday, 23 May 2022 4:13 PM
New Delhi . Taiwanese chip maker MediaTek on Monday announced the Dimensity 1050 system-on-chip, its first mmWave 5G chipset that will power next-generation 5G smartphones.
Through dual connectivity using mmWave and sub-6GHz, the Dimension 1050 5G claims to deliver the speed and power needed to provide a seamless experience to smartphone users.
“With faster, more reliable connections and advanced camera technology, this chip provides powerful features to help devices differentiate their smartphone product lines,” said CH Chen, deputy general manager of the Wireless Communications Business Unit at MediaTek.
The Dimension 1050 will be able to deliver up to 53 percent faster speeds and greater accessibility to smartphones than LTE plus mmWave aggregation alone.
The SoC integrates two premium ‘Arm Cortex-A78 CPUs’ with speeds reaching up to 2.5GHz and the latest Arm Mali-G610 graphics engine.
The chipset also offers Wi-Fi optimization along with MediaTek’s HyperEngine 5.0 gaming technology to ensure low-latency connections with the new tri-band 2.4 GHz, 5 GHz and 6 GHz, which increases game time and performance. Is.
It also supports super-fast 144Hz Full HD+ display, Dual HDR video capture engine, noise reduction for great low-light photos and Wi-Fi 6E support.
MediaTek also announced two additional chipsets – Dimensity 930 and Helio G99.
The company said that smartphones powered by the Dimensity 930 will be available during the second quarter of 2022 and the Dimensity 1050 and Helio G99 smartphones will hit the market in the third quarter of this year.
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